Visit us in Manila
June 5-7, 2013
SMX Convention Center, Pasay City (Metro Manila)
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is virtually identical to the 200mm ADM200 automatic eWLB debonding machine that ERS first brought to market in 2008. The ERS automatic tools offer not only safe separation of the eWLB substrate from its carrier, but also a throughput-enhancing preparation chamber, advanced robotic handling, complete ID control and a network connection to support factory automation. The flash control and shape monitoring functions in the ERS eWLB debonding tools offer inline solutions to challenges that originally required expensive extra process steps or offline tools.
| Wafer Size | 300mm |
| Handling System | Two 3-axis robots |
| UPH | 15-20 depending on product and production conditions |
| Temperature control | DC PID and ERS AirCool® components |
| Temperature Range | +20°C up to +240°C (depending on station) |
| Debond Force | Adjustable |
| Laser Marking | Diode-pumped system, 1064 nm |
| Dimensions (W x D X H) | 3126mm x 1856,5mm x 2105mm |
| Weight | 1700kg |
| Voltage | 400 VAC 3 Phase 32A |
| Frequency | 50 / 60Hz |
| Power | 20 kW |
| CDA Pressure | 6 bar at 0°C Dewpoint |
| CDA Flow Rate | 1000l/min peak |
| Vacuum Pressure | 100mbar |
| Vacuum Flow Rate | 100l/min |
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