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Designing and building new tools for both test and production
based on a broad range of high-tech ERS thermal solutions

ADM 300 eWLB Debonding System

The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is virtually identical to the 200mm ADM200 automatic eWLB debonding machine that ERS first brought to market in 2008. The ERS automatic tools offer not only safe separation of the eWLB substrate from its carrier, but also a throughput-enhancing preparation chamber, advanced robotic handling, complete ID control and a network connection to support factory automation. The flash control and shape monitoring functions in the ERS eWLB debonding tools offer inline solutions to challenges that originally required expensive extra process steps or offline tools.

eWLB Debonding FOWLP Warpage
Wafer Size 300mm
Handling System Two 3-axis robots
UPH 15-20 depending on product and production conditions
Temperature control DC PID and ERS AirCool® components
Temperature Range +20°C up to +240°C (depending on station)
Debond Force Adjustable
Laser Marking Diode-pumped system, 1064 nm
Dimensions (W x D X H) 3126mm x 1856,5mm x 2105mm
Weight 1700kg

Facility Supply

Voltage 400 VAC 3 Phase 32A
Frequency 50 / 60Hz
Power 20 kW
CDA Pressure 6 bar at 0°C Dewpoint
CDA Flow Rate 1000l/min peak
Vacuum Pressure 100mbar
Vacuum Flow Rate 100l/min
 
 
 

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