Visit us in Manila
June 6-8, 2012
SMX Convention Center, Pasay City (Metro Manila)
Hall 1, Booth 147
PowerSense® Chuck System
The Unique High Energy Dissipation Solution
ERS® PowerSense® provides a novel solution to detecting and dissipating heat during wafer test for extremely high-wattage high-end logic chips.
- Up to 5000W energy dissipation
- Most efficient heat transfer
- Temperature ranges from -55 to +200 °C
- Near-zero maintenance requirements
- Low-noise capability in the fA-range
- Dissipation at hot sort possible
- Cold testing suitable for the wafer production floor
- Compatible with all major production probers and all major analytical probers
- Full hardware and software integrations available
Senses and instantly compensates changes in chuck temperature
The near simultaneous sensing and removing of heat added during test evokes the image of the chuck as a power sensing device. Added heat is, in fact, removed by reducing energy to the chuck. The patented Active Dissipation Control (ADC) dramatically reduces the overall thermal resistance of the system.
High rigidity allowing a wide range of applications
The wafer chuck on the PowerSense® system is extremely rigid and suitable for probing both with densely-populated probe cards for high end logic test as well as for high parallel probe cards used in DRAM and Flash device applications.
| Coolant | Air (user supplied) or liquid |
| Heater | Resistance heater |
| Power dissipation: | up to 5 kW |
| Temperature stability | ± 0.08 °C |
| Temperature display resolution | 0.01 °C |
| Temperature uniformity | ± 0.5°C or ± 0.5% of actual temperature |
| Thermal resistance to wafer | < 0.1 °C/W typical |
| Insulation resistance | > 0.5 TOhm |
| Chuck surface flatness | ± 5 µm at +25 °C |
| Chuck weight load | up to 4500 N |
| Communication interface | RS232 and Ethernet |
The temperature range and cooling speed depend on the type of wafer prober with which the system is used. Detailed specifications for the respective prober are available on request.
Please order our PowerSense® product brochure to get more information. For futher information and application notes, please log in to our product support section.
Product slideshow
AirCool® consists of various components, depending on the modules and the wafer prober. wide temperature range, compact chiller, low power.
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