Visit us in Manila
June 5-7, 2013
SMX Convention Center, Pasay City (Metro Manila)
ERS produced the first thermal chuck for wafer test in 1970 and has led the industry since. In the late 80's true production cold test in automatic wafer probers first became thinkable with the ERS SuperCool®. By the early 90's ERS moved to air-only cooling and reliability expectations changed forever.
ERS is a development company with a surprisingly large production capability for true high-volume delivery performance. The heart of the ERS technology is thermal wafer test technology provided in a reliable product that not only meets the customer requirements but does so with a benchmark development.
One of the key components of the ERS success in the past 20 years was the decision to develop sophisticated a thermal product line exclusively cooled with air. Products such as the ERS AirCool® and the ERS AirCool® plus are now famous in the industry for their innovative solutions and, above all, for their reliability in the field.
A second key component of ERS's success is the willingness and genuine interest in the special thermal challenges of our customers. When other vendors encounter a problem and decline to take the trouble to build the solution, ERS is often able to meet the need and do so in a win-win way.
ERS products are developed in an atmosphere characterized by ERS's 40-year history, its dedication to thermal solutions and its irreverent attitude to the common wisdom of what is possible and what is not.
Unimaginable solutions becoming reality. A common and welcome customer response when seeing a new ERS development for the first time is "How do you do that?"
Quality is the inevitable outcome of ERS‘s philosophy of design, manufacture and customer support. The old saying that our customers’ success is our success is embraced by the entire ERS team.
The long list of ERS successes in thermal test is due not just to excellent engineering. An important part of the ERS success story is making the correct decision on what to develop and what to leave behind.
© ERS electronic GmbH | Thermal wafer chucks | Solutions for the semiconductor industry | imprint | home | login