ERS electronic GmbH, market leader in the field
of thermal wafer chucks in semiconductor production, is broadening the range of
applications for its proven air-only cooling technology. New products coming
out this year from the German high-tech company will make the native advantages
of this technology available to applications beyond those that originally made
air-cooling so successful in semiconductor thermal test. The new products,
currently in the prototype stage, will address the critical issues of
semiconductor test: cost, throughput and functional integration. Depending on
the customer application, ERS sees the possibility to achieve double-digit
increases in test throughput.
The initial drivers of ERS’s air-only cooling
success seen in the ERS AC3 thermal chuck system were reliability, reduced
footprint and a lower cost of ownership. As the company responded to
customer requests for special applications over the past several years, it
realized that the inherent flexibility of air-cooling is what made many of the
special requests possible. The reason is that a thermal system based on
liquid cooling is a closed circuit: after it has delivered chilling power where
it is needed, the liquid coolant must necessarily be returned to its starting
point to be re-chilled. An air-only cooling system, however, can be
implemented as a semi-closed or even a completely open system. Exhausted
coolant eventually leaves the system as clean, dry air. "It is exactly
this flexibility that makes it possible to keep more than just the wafer at a
controlled temperature in creative ways," said Klemens Reitinger, General
Manager of ERS GmbH.
At this year’s Semicon West in San Francisco,
ERS will show a stronger, air-only chiller that won’t require additional
footprint and will offer unmatched flexibility in applying temperature control
where needed. Visitors to ERS will have the opportunity to see how this
system can control the temperature of peripheral hardware according to
individual customer requirements, increasing throughput and stabilizing the
thermal test process overall.
ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this yea...
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One and a half years after its launch, ERS electronic GmbH's FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, resea...
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ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
AirCool
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-gen...
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Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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Munich - ERS electronic GmbH recently announced the launching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence ...
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Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
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TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...
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In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
read more ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
Semicon West 2013, July 9-11, 2013
San Francisco Moscone Center ,
Semicon Taiwan 2013, September 4-6, 2013
Nangang Exhibition Hall,
Semicon Japan 2013, December 4-6, 2013
Makuhari Messe, Hall 2, #2A-609
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