15.02.2012: ERS displayed sub-zero module of its new AirCool®3 System in Tokyo
ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
AirCool
News at ERS
10.03.2011: ERS Launches FOWLP Global Competence Center
Munich - ERS electronic GmbH recently announced the lauching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence based on 40 years of experience in designing and manufacturing semiconductor production tools, ERS is a worldwide leader in the field of thermal technologies in the semiconductor industry. For more than six years, ERS has been committed to eWLB packaging technology through the development of innovative production tools for this promising technology.
ERS is currently cooperating on FOWLP process technology with chip makers, sub-cons (OSAT's), materials makers and other tool makers supporting this advanced wafer-level packaging with ERS's own debonding and warpage adjusting technologies.
Further news
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11.10.2011: ERS introduces AirCool®3 at Semicon Europa 2011
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-gen...
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30.04.2011: ERS Receives eWLB Patent in Singapore
Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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10.03.2011: ERS Receives eWLB Patent in Japan
Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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10.06.2010: Shipment of the ADM300 Debonding System
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
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28.05.2010: ERS awarded ISO 9001:2008 Recertification
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...
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17.12.2008: ERS defends AirCool® Plus and PowerSense® patents
In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
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Industry Exhibitions and Conferences
ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
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Visit us in Manila
June 6-8, 2012
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SMX Convention Center, Pasay City (Metro Manila)
Hall 1, Booth 147
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Meet with us in San Diego
June 10-13, 2012
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Rancho Bernardo Inn, San Diego, CA
Booth 19
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Visit us in San Francisco
Semicon West 2012, July 10-12, 2012
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San Francisco Moscone Center , South Hall, Booth #530 -
Visit us in Taipei
Semicon Taiwan 2012, September 5-7, 2012
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Nangang Exhibition Hall, -
Visit us in Dresden
Semicon Europa 2012, October 9-11, 2012
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Messe Dresden, Hall 1, Booth #1.234 -
Meet with us in San Jose
International Wafer Level Packaging Conference 2012, 5-8 November, 2012
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Doubletree by Hilton Hotel, San Jose CA, -
Visit us in Tokyo
Semicon Japan 2012, December 5-7, 2012
More information
Makuhari Messe, Hall 7, #7D-724
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