TÜV Deutschland, a recognized expert for helping high-tech companies comply with
industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008
recertification. The certification is valid until February 2013. ISO, the International Organization for Standardization
(www.iso.org), is the world’s largest developer and publisher of International
Standards established by a membership of 157 countries. ISO 9001:2008 is the
formal certification awarded to organizations that have established a quality
management system adhering to rigorous standards of customer service,
performance objectives and continual improvement.
View ISO 9001:2008 certificate
ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this yea...
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One and a half years after its launch, ERS electronic GmbH's FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, resea...
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ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
AirCool
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-gen...
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Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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Munich - ERS electronic GmbH recently announced the launching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence ...
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Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
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In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
read more ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
Semicon West 2013, July 9-11, 2013
San Francisco Moscone Center ,
Semicon Taiwan 2013, September 4-6, 2013
Nangang Exhibition Hall,
Semicon Japan 2013, December 4-6, 2013
Makuhari Messe, Hall 2, #2A-609
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