15.02.2012: ERS displayed sub-zero module of its new AirCool®3 System in Tokyo

ERS presented its new wafer thermal test system - the ERS AirCool^®3 - during the Semicon Japan 2011. The AirCool read more

11.10.2011: ERS introduces AirCool®3 at Semicon Europa 2011

ERS announces the ERS AirCool^®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility  in thermal  wafer probing. The AirCool^®3 is ERS’s third-gen...

30.04.2011: ERS Receives eWLB Patent in Singapore

Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.

10.03.2011: ERS Launches FOWLP Global Competence Center

Munich - ERS electronic GmbH recently announced the lauching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.

With its competence b...

10.06.2010: Shipment of the ADM300 Debonding System

The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...

28.05.2010: ERS awarded ISO 9001:2008 Recertification

TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...

17.12.2008: ERS defends AirCool® Plus and PowerSense® patents

In December of 2008, ERS successfully defended its AirCool^® Plus and PowerSense^® patents against challenges made before a court in Munich, Germany. The AirCool^® Plus patent protects ...