11.10.2011: ERS introduces AirCool®3 at Semicon Europa 2011
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-generation thermal chuck system that exclusively uses air for cooling. It combines the advantages of the ERS AirCool® and the ERS AirCool®plus systems into one modular system designed to be quickly upgradeable on site. Adaptations for the AirCool®3 are available for all major wafer prober models.
We look forward to showing you this system on the ERS booth (#1.222 in Hall 1) at the Semicon Europe from 11-13 October 2011 ( 10:00 to 17:00, 16:00 on Thursday) in the Messe Dresden Exhibition Center. Displayed on our stand will be flexible integration possibilities of the AirCool®3 modular internal component construction. These include zero footprint applications and semi-remote touch-panel control. We will also have a live demonstration of changing the thermal controller set-ups to show the unmatched flexibility of the AirCool®3.
01.02.2013: New air-only applications from ERS bring higher throughput to wafer thermal test
ERS electronic GmbH, market leader in the field
of thermal wafer chucks in semiconductor production, is broadening the range of
applications for its proven air-only cooling technology. New products coming
out this yea...
05.12.2012: ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market
One and a half years after its launch,
ERS electronic GmbH's FOWLP (Fan-out Wafer Level Packaging) competence center
near Munich (Germany) is being utilized by an increasing number of
semiconductor chip makers, resea...
15.02.2012: ERS displayed sub-zero module of its new AirCool®3 System in Tokyo
ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
30.04.2011: ERS Receives eWLB Patent in Singapore
Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
10.03.2011: ERS Launches FOWLP Global Competence Center
Munich - ERS electronic GmbH recently announced the launching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence ...
10.03.2011: ERS Receives eWLB Patent in Japan
Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
10.06.2010: Shipment of the ADM300 Debonding System
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding
tool for the high-performance eWLB package - it also represents the most mature
technology on the market. The operation of the ADM300 is...
28.05.2010: ERS awarded ISO 9001:2008 Recertification
TÜV Deutschland, a recognized expert for helping high-tech companies comply with
industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008
recertification. The certification is valid until Feb...
17.12.2008: ERS defends AirCool® Plus and PowerSense® patents
In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense®
patents against challenges made before a court in Munich, Germany. The AirCool®
Plus patent protects ...