ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-generation thermal chuck system that exclusively uses air for cooling. It combines the advantages of the ERS AirCool® and the ERS AirCool®plus systems into one modular system designed to be quickly upgradeable on site. Adaptations for the AirCool®3 are available for all major wafer prober models.
We look forward to showing you this system on the ERS booth (#1.222 in Hall 1) at the Semicon Europe from 11-13 October 2011 ( 10:00 to 17:00, 16:00 on Thursday) in the Messe Dresden Exhibition Center. Displayed on our stand will be flexible integration possibilities of the AirCool®3 modular internal component construction. These include zero footprint applications and semi-remote touch-panel control. We will also have a live demonstration of changing the thermal controller set-ups to show the unmatched flexibility of the AirCool®3.
ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this yea...
read more
One and a half years after its launch, ERS electronic GmbH's FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, resea...
read more
ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
AirCool
Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
read more
Munich - ERS electronic GmbH recently announced the launching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence ...
read more
Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
read more
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...
read more
In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
read more ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
Semicon West 2013, July 9-11, 2013
San Francisco Moscone Center ,
Semicon Taiwan 2013, September 4-6, 2013
Nangang Exhibition Hall,
Semicon Japan 2013, December 4-6, 2013
Makuhari Messe, Hall 2, #2A-609
© ERS electronic GmbH | Thermal wafer chucks | Solutions for the semiconductor industry | imprint | home | login
